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VD0577 P-type Silicon Evaporation Materials, Si

Material：Silicon (Si) (P-type)
Purity：99.9% ~ 99.999%
Shape：Powder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity P-type silicon evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and customized options are available upon request.

MSDS File

P-type Silicon Evaporation Materials Description

Silicon is a crucial metalloid with a melting point of 1,410°C and a density of 2.32 g/cc. At a temperature of 1,337°C, its vapor pressure is approximately 10^-4 Torr. This element is known for its brittle nature, making it prone to chipping. Silicon serves as a fundamental semiconductor in the electronics and computing sectors, where it is commonly doped with elements like arsenic, phosphorus, or boron, depending on the specific requirements of the application.High-purity P-type silicon evaporation materials are essential in various deposition processes, ensuring the production of high-quality thin films. TFM specializes in manufacturing silicon evaporation materials with purity levels reaching up to 99.999%. Their rigorous quality assurance protocols guarantee the reliability of these products.

silicon p-type evaporation materials

P-type Silicon Evaporation Materials Specification

Material TypeP-type Silicon
SymbolSi
Color/AppearanceDark Gray with a Bluish Tinge, Semi-Metallic
Melting Point1,410 °C
Density2.32 g/cc
Thermal Conductivity150 W·m-1·K-1 (25°C)
Thermal Expansion2.6 x 10-6/K (25°C)
Bulk Resistivity0.005-0.020 OHM-CM
SynonymsP-type Silicon Pellets, P-type Silicon Pieces, P-type Silicon Evaporation Pellet, P-type Si Pellets, P-type Si Pieces, P-type Si Evaporation Pellet

P-type Silicon Evaporation Materials Application

P-type silicon evaporation materials are utilized in several advanced processes, including:

  • Semiconductor Fabrication: Vital for the production of integrated circuits and other electronic devices.
  • Chemical Vapor Deposition (CVD): Employed in creating thin films for various applications.
  • Physical Vapor Deposition (PVD): Used for depositing materials in a vacuum environment, crucial for device manufacturing.

P-type Silicon Evaporation Materials Packaging

These materials are available in multiple forms, such as powders and granules, and can be customized to meet specific size and purity requirements. TFM’s commitment to handling these materials with care ensures that they maintain their integrity during storage and transport.

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TFM offers a diverse range of P-type silicon evaporation materials, available in various forms, purities, sizes, and pricing options. Our focus is on producing high-purity e-beam evaporation materials that achieve the highest possible density and the smallest average grain sizes, ensuring optimal performance in your applications.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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